Why WDS 620 BGA Rework Station ?
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.
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The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins.
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A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can, so they are not mechanically compliant.
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